he Contamet process is a direct metallization process based on tin/palladium colloids which are adsorbed to the surface. Subsequently the conductive layer is enforced by Cu-particles, giving a superior conductivity for acid copper plating. Contamet process is available for vertical and horizontal system.

 
  直接金屬化制程 — Contamet ; 使用錫鈀膠體系統, 膠體能均勻吸附于孔內非導電層而型成導電膜. 同時以銅做為連結, 大幅提高導電膜之導電度, 有助于后續電鍍銅之均勻覆蓋. Contamet制程適用于垂直或水平設備.